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Info Chemical delivery systems Magic auto Magic compact Magic solar

The SCR Engineering specializes in custom-made production of new equipment for semiconductor and photovoltaic industry and for chemical laboratories and for revision, checking, renovation and reparation of current equipment as FSI Mercury, FSI Saturn, FSI Titan and distribution of refurbished equipment. We are also suppliers of components and spare parts for semiconductor industry.

For our equipment we always use components according customer´s wish, as for example components from companies Nitta Moore Company, Entegris, Process Technology, Parker, SMC, Ham-Let, Omron, Turck and others.

The production of new equipment has recently been the prevailing part of our activities and is going to take even more significance. Our equipment is constructed as to be compatible with CE and SEMI standards. Control electronics is hermetically separated from the process part to avoid corrosion caused by aggressive chemical steams. Frames are produced from high quality plastics with long operating life as from PVDF, FRPP, PP or FM4910 compatible (Takiron, Corzan). Distributing systems of chemicals, DI water, nitrogen, flow-meters, filters and valves do not contain any metal components. All materials and components are in „High purity“ execution. The equipment is controlled by reliable and powerful control system with „friendly“ user interface. Control system for communication with operator has been MS Windows CE © compatible and a delivery in any language is possible.

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CHEMICAL DELIVERY SYSTEMS

  • One or two drum configuration
  • Automatic change over
  • Close loop with filter
  • Easy maintenance and use
  • Computer network support
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Configuration:
  • One or two drum configuration
  • Maximum size of drum is 200 litres (55 gallons)
  • FRPP frame
  • FM4910 frame is available
  • Mixing station configuration
  • Stainless Steel model for flammable liquids
  • PTFE diaphragm pump
  • PFA housing with 10“ filter cartridge
  • Close loop
  • PFA pneumatic operated valves
  • High purity
Process Control:
  • PLC based controller
  • HMI interface
  • Windows CE © compatible
  • Remote control / monitoring
  • Computer network support
Chemicals:
  • Sulfuric Acid
  • Hydrochloric Acid
  • Hydrofluoric Acid
  • Nitric Acid
  • Phosphoric Acid
  • Ammonium Hydroxide
  • Sodium Hydroxide
  • Potassium Hydroxide
  • Hydrogen Peroxide
  • Chemical Mixture
Safety Features:
  • Door with electronics sensor
  • Spray guns
  • Independent shut-down system
  • Aspirator
  • Leak sensors
  • Inert gas purging
  • On-line flow monitor
  • Excess flow sensory

Automatic - Immersion Cleaning Systems

  • Automatic wet bench station
  • One or two wafer carriers
  • Wafer size from 4“ up to 8“
  • Easy maintenance and use
  • Computer network support
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Application Include:
  • Buffered oxide etch (BOE)
  • Hydrofluoric acid
  • PAN etch (Phosphoric, Acetic, Nitric acids)
  • Phosphoric acid
  • Acetic acid
  • SC1 mixture
  • SC2 mixture
  • Sulfuric acid and Hydrogen peroxide mixture
Tank Sizes:
  • One or two wafer carriers
  • Size from 4“ up to 8“ wafers
  • Custom design tanks is available
Safety Features:
  • Front door with electronics sensor
  • Spray guns
  • Aspirator
  • Capacitive style liquid level sensor
  • Inert gas purging
  • Heater purge backpressure monitor
  • Heater element over-temperature sensor
  • Pump motor gas purge flow monitor
Temperature range:
  • PVDF tanks up to 100°C
  • PFA / PTFE tanks up to 180°C
  • Quick Dump Rinse Tank up to 80°C
Process / Temperature Control:
  • PLC based controller
  • HMI interface
  • +/- 0,2°C chemical stability attainable
  • Windows © compatible
  • SECSII/GEM protocol
  • Computer network support
  • Fully robotics arm
Cascading Quick Dump Rinser:
  • Durable PP or PVDF construction
  • Knife edge cascading inner weir overflow
  • Top spray and bottom fill manifold
  • Pneumatic dump door
  • Bottom fill valve with bypass flow capability
  • Hot DI water compatible
Heater configuration:
  • Patented, gas purged, PTFE construction
  • 120 volts to 600 volts, single or three phase available
 

Manual Batch - Immersion Systems

  • Manual wet bench station
  • One or two wafer carriers
  • Wafer size from 4“ up to 8“
  • Computer network support
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Application Include:
  • Buffered oxide etch (BOE)
  • Hydrofluoric acid
  • PAN etch (Phosphoric, Acetic, Nitric acids)
  • Phosphoric acid
  • Acetic acid
  • SC1 mixture
  • SC2 mixture
  • Sulfuric acid and Hydrogen peroxide mixture
  • Ozone
Tank Sizes:
  • One or two wafer carriers
  • Size from 4“ up to 8“ wafers
  • Custom design tanks is available
Process / Temperature Control:
  • PLC based controller
  • HMI interface
  • Local control terminals for each tank
  • +/- 0,2°C chemical stability attainable
  • Windows © compatible
  • Computer network support
Temperature range:
  • PVDF tanks up to 100°C
  • PFA / PTFE tanks up to 180°C
  • Quick Dump Rinse Tank up to 80°C
Heater configuration:
  • Patented, gas purged, PTFE construction
  • 120 volts to 600 volts, single or three phase available
Cascading Quick Dump Rinser:
  • Durable PP or PVDF construction
  • Knife edge cascading inner weir overflow
  • Top spray and bottom fill manifold
  • Pneumatic dump door
  • Bottom fill valve with bypass flow capability
  • Hot DI water compatible

Automatic Batch - Immersion Systems for Solar cells

  • Wet bench station for solar cells production
  • Wafer size from 100x100 mm up to 210x210 mm
  • Batch capacity 50, 100 or 200 wafers
  • Automatic, semiautomatic or manual configuration
  • Computer network support
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Application Include:
  • Saw damage
  • Texturing
  • Acidic texturing
  • Pre-diffusion cleaning
  • PSG etch
Safety Features:
  • Spray guns
  • Aspirator
  • Capacitive style liquid level sensor
  • Inert gas purging
  • Heater purge backpressure monitor
  • Heater element over-temperature sensor
  • Pump motor gas purge flow monitor
  • Exhaust monitor
Configuration:
  • Ultrasonic bath
  • On-line chemical monitoring
  • Built-in dryer
  • Top cover for chemical baths
  • Chemical dispensing manifold
  • Additional ports for level sensing and automatic chemical fill
  • Recirculation
  • In-line filter chamber
  • Chiller system
  • Fume bezel
  • Membrane style switch panel with process display for each tank
Process/Temperature Control:
  • PLC based controller
  • HMI interface
  • +/- 0,5°C chemical stability attainable
  • Windows © compatible
  • Computer network support
  • Fully robotics arm
Tank sizes:
  • Wafer carriers for 50 or 100 wafers
  • Size from 100x100 mm up to 210x210 mm wafers
  • Custom design tanks is available
Cascading Rinser :
  • Durable PP, PVDF or SS PFA coated construction
  • Knife edge cascading inner weir overflow
  • Top spray and bottom fill manifold
  • Pneumatic dump valve
  • Bottom fill valve with bypass flow capability
  • Hot DI water compatible
  • Quick Dump Option